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By referring to Figure 764, it can be seen that for a design clearance of 05 10 3 in the jet diameter is 10 10 3 in when b/a is 3 A correction is required since the figure is plotted based on 50 lbf/in2 The multiplication factor is obtained from the vertical axis at the intersection of a supply pressure of 75 lbf/in2 with the curve of Figure 765 (a) The corrected diameter is given as 12 (10 10 3) = 0012 in The influence of pressure, temperature and gas properties on the optimum jet diameter and mass flow is similar to that of the journal bearings, and the related figures can be applied for the design of thrust bearings In this case, multiple jets will be arranged, feeding into a circular groove of radius given by c2 = 10 075 = 075 c = 0866 in The number of feed holes will be determined in the limit by the smallest size that can be drilled Figure 765 (b) shows the variation in feed hole diameter with the number of feed holes The practical choice of most designers would lie between eight and 16 and possibly the best compromise between considerations of aerostatic instability and manufacturing difficulty would be to use 12 feed holes of a 72 10 3 in diameter The final drawing is as shown in Figure 766 Figure 767 and Figure 768 clearly show the use of aerostatic bearings in the work spindle and the grinding spindle, respectively Both the spindles employ aerostatic journal bearings and aerostatic thrust bearings to obtain the various advantages of ultra-precision applications

This thermocouple effect is desirable in the case of temperature measurements However, in the case of other low-level measurements it is an undesirable characteristic Therefore, the requirement for low-signal-level PCDs is to ensure that all components and electrical interconnection networks and corresponding electrical terminations (such as soldered, welded, wire-bonded, or conductive adhesive) are symmetrical and isothermal Electrical components, such as thin/thick-film resistors of different values (resistance), may have resistor elements.

This chapter has reviewed the processing issues and materials used for the soldering and cleaning processes. In the lead-free era, thermal profiles and component maximum temperatures require different reflow profiles. The various types of soldering fluxes, their constituents, and their role in the soldering process have been discussed and the formulation changes required for the higher temperature soldering examined. Cleaning materials and processes have been identified and the challenges with higher temperature soldering discussed.

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1. Fisher, D. A., et al., Relative Effects on Stratospheric Ozone of Halogenated Methanes and Ethanes of Social and Industrial Interest, Scientific Assessment of Ozone: 1989. Vol. II. World Meteorological Organization Global Ozone Research and Monitoring Project, Report No. 20, 1989, pp. 301 377. 2. IPC/JEDEC J-STD-020C, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices. July 2004. 3. ANSI/IPC-T-50G, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. December 2003. 4. MIL-F-14256, Flux, Soldering, Liquid (Rosin Base). June 15, 1995. 5. ANSI J-STD-004A, Requirements for Soldering Fluxes, available from the IPC. January 2004. 6. IPC-TM-650, IPC Test Methods Manual. January 2003. 7. Zado, F. M., Effects of Non-Ionic Water Soluble Flux Residues, The Engineer, Vol. 27, No. 1, p. 40. (1983). 8. Brous, J., Electrochemical Migration and Flux Residues Causes and Detection, Proceedings of NEPCON West, February 1992, pp. 386 393. 9. Mitchell, J. P., and. Welsher, T. L., Conductive Anodic Filament Growth in Printed Circuit Materials, paper prepared for the Circuit World Convention II, Munich, published as IPC Technical Report WC2A-5, June 1981. 10. Biocca, Peter, Flux Chemistries and Thermal Profiling:Avoiding Soldering Defects in SMT Assembly, Proceedings of SMTA International, Chicago, September 30, 2001. 11. Cala, F.R., and Winston, A.E., Handbook of Aqueous Cleaning Technology for Electronic Assemblies, Electrochemical Publications, 1996. 12. Post Solder Solvent Cleaning Guidelines, IPC-SC-60. August 1999. 13. Post Solder Semiaqueous Cleaning Guidelines, IPC-SA-61A. June 2002. 14. Post Solder Aqueous Cleaning Guidelines, IPC-AC-62A. January 1996.

15. Guidelines for of Cleaning Printed Boards and Assemblies, IPC-CH-65A. September 1999. 16. Kanegsberg, B., and Kanegsberg, E., Handbook for Critical Cleaning, CRC Press, 2001. 17. Sanders, J. R., Chute, S., Soma, J., and Fouts, C., A Comparison of Cleaning Technologies for New Lead-Free Solder Paste Formulatons, Proceedings of SMTAI International, 2005, pp. 871 875. 18. Breunsbach, R., New Developments in Simplified, Low Cost, Semi-Aqueous Emulsion Cleaning Technology, Proceedings of NEPCON West, 1992, pp. 1217 1225. 19. M., Bixenman, Miller, E.,and Rued, F., Lessons Learned and Best Practices Developed for Cleaning Pb-Free Flux Residues from Printed Circuit Assemblies and Advanced Packages, paper presented for the IPC/JEDEC International Conference on Lead-Free Electronic Components and Assembly, 2006, Singapore. 20. Tosun, Umut, Wack, Harald, Becht, Joachim, Schweigart, Helmut, Afshari, Sia, and Ellis, Drik, Defluxing of Eutectic and Lead-Free Assemblies in a Single Cleaning Process, Proceedings of SMTAI International, Chicago, September 24 28, 2006, p. 160. 21. Davies, Matt, Chute, Susan, Sanders, John R., Soma, Jay, and Fouts, Christine, A Comparison of Lead-Free Solder Assembly Defluxing Processes, Proceedings of PC EXPO/APEX 2006, Anaheim, February 5 10, 2006, S08-03-1.

Soldering is a technology that has been used extensively for utilitarian and decorative purposes for thousands of years In the last 100 years, soldering has been raised from art to science for joining electrical assemblies By the late twentieth century, the tin-lead solder joint and properties of its constituent materials had been studied well enough that it could be modeled for purposes of predicting reliability Circuit board soldering has traditionally been accomplished with eutectic or near eutectic tin-lead (Sn-Pb) The eutectic alloy is approximately 63 percent Sn and 37 percent Pb by weight and is the mainstay of printed circuit board assembly A binary alloy (composed of two constituent metals), its melting and solidification are well understood and predictable Being a eutectic alloy, it has a distinct melting point of 183 C.

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