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This temperature is low enough that it is compatible with a significant set of materials such as circuit board laminates, integrated circuit (IC) package encapsulants, ceramics used for packaging, silicon devices, molded connector bodies, etc Materials for these components were in part codeveloped for use with Sn-Pb solder for joining Now the electronics industry is faced with tremendous change spurred mainly by the European Union s (EU) environmental initiatives to limit electronics waste and restrict toxic materials used in electronic manufacturing The main thrust of the legislation is to limit or ban a short list of materials that the EU deems harmful to the environment Lead (Pb) is most prominent on the list of restricted materials, and limitations on its use have the biggest impact to electronics manufacturing Now the industry is forced to adopt Pb-free solder alloys Most viable Pb-free alloys have a higher melting temperature than Sn-Pb solder.

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Most Pb-free alloys are composed of three or more metals All of this comes at a time when circuit board component density, layer count, and performance are higher than ever before The complexity of printed circuit assemblies continues to increase in every sector of the electronics industry The number of solderable contacts of IC components is on the rise as circuit board components both miniaturize and increase in body size due to ever-increasing input/output (I/O) count Through-hole technology, although on the wane, is still prevalent Motherboards for personal computers are more powerful than computer room servers that are only a few years older Consumer electronics are highly sophisticated and internally complex Mobile telephones are multifunctional incorporating still- and video-cameras, personal digital assistants (PDAs), wireless Internet, and localized wireless connection to user devices such as hands-free devices, all in smaller and smaller packages.

Portable music systems such as MP3 and MP4 players have more memory than many.

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personal computers (PCs) in use today They must be built small enough to fit in a pocket and be shock-resistant The ever-increasing demand for product performance drives increases in component density, the number of I/Os, increased board layers, and finer printed wiring board conductor trace spacing in order to make electrical routing possible Higher density boards and higher layer counts result in more thermally massive assemblies, which are more difficult to solder during surface mounting and doubly difficult to assemble during wave soldering When both surface mounting and wave soldering are used on the same assembly, it is referred to as mixed-mount technology The proliferation of press-fit connections (force fitting compliant electrical contacts into a circuit board s plated through-holes) has alleviated some of the problems of mixed-mount assembly and has been driven largely by the difficulties faced in wave soldering large and thick circuit boards See Chap.

Jet diameter d * (in 10 3)

49 in this book for an introduction to press-fit technology Land grid arrays (LGAs) with separable pressure interconnect has become more prevalent especially for highend motherboards for computing and telecommunications LGA incorporation on a board has influence on layout and implications for soldering This will be discussed in Chap 50 In the fifth edition of this handbook, there was a separate chapter on Pb-free soldering Since Pb-free is now the primary focus of electronics manufacturing, its impact has been incorporated into the text of this chapter, which previously concentrated only on Sn-Pb soldering The reader should understand that Sn-Pb soldering is still important, as many types of electronic assemblies will still be manufactured with lead-based solders until the year 2010 as per the new EU Restriction of Hazardous Substances (RoHS) legislation.

Also, there may be problems associated with mixing Pb-free solders with leaded (Pb d) packages and Pb-free packages with Pb d solder Since the latest EU legislative initiatives have profound effects on every aspect of electronics manufacturing, it is necessary to understand the impacts before delving into the technology of soldering..

There are three important constituents of a solder joint: the two materials or surfaces to be joined and the solder itself. Each has its own set of attributes and variables that contribute to the ease and quality of soldering. A delicate balance of material conditions and process parameters determine the solder joint appearance, resultant strength, and reliability of the soldered assembly. The composition of the solder, the surface finish on lead, pad or plated through-hole (PTH), environmental factors, chemical implications, and thermal conditions all impact the soldering process. Each will be discussed.

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